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From the Product Architecture – supporting high-precision modular electronics
PCB + Components Sourcing + SMT + Packaging + Testing. One-stop service from prototype to mass production.
Advanced hybrid process ideal for high-precision and miniaturized products such as optical modules, wearable electronics and RF boards.
SPI / AOI / X-ray / ICT / FCT inspection + MES Traceability for full process control and quality consistency.
YAMAHA High-Speed High-Precision Mounter · GKG Solder Printer · Sinicteck SPI/AOI · Vitronics Soltec Reflow · SCIENSCOPE X-Ray
01005 / 0201 micro-components · LGA / QFN / BGA · SIP / POP / COB · Flip-Chip / wafer-level packaging
Daily SMT capacity exceeds 20 million chips · Monthly output over 500 million chips · Flexible for prototyping & stable mass production