Backed by our own OEM factory (since 2009), we use SMT + COB hybrid processes to deliver full-cycle PCBA OEM services — from component sourcing and assembly to packaging and testing — across optical modules, RF modules, wearables and other custom electronic modules.
Our product structure is organized by application.
PCB and component sourcing, SMT, COB, device packaging and testing in one workflow.
Combined surface-mount and chip-on-board processes for high-precision, miniaturized products.
Flip-chip down to 110 μm bump pitch, CoC and CoS assembly, and hermetic TO / BOX device packaging.
Full-process SPI / AOI / X-Ray / ICT / FCT inspection with MES traceability.
Shenzhen Sunwin Electronics Technology Co., Ltd. is backed by its own OEM factory, in operation since 2009. Sunwin provides OEM manufacturing — not product design — for optical communication PCBA and device packaging, wireless communication PCBA and custom module PCBA.
| Manufacturing base | 8,000+ m² four-floor facility in Shenzhen, 21 SMT lines, 300+ employees |
|---|---|
| SMT capacity | More than 30 million placements per day; over 800 million per month |
| Device packaging | More than 150,000 MEMS optical TO assemblies per month; Class 10,000 cleanrooms |
| Key processes | 01005 placement (99.99% first-pass yield), flip-chip down to 110 μm bump pitch, SMT + COB, CoC / CoS, TO and BOX hermetic sealing |
| Certifications | ISO 9001, ISO 14001, IATF 16949, QC 080000 (HSPM) |
| Optical communication | Serving 50+ optical communication customers, including more than ten listed companies |
Confirm product category, specs and target lead time.
DFM review, component sourcing and sample validation.
SMT / COB line scheduling and first-article confirmation.
Full SPI / AOI / X-Ray / FCT testing.
ESD-safe packaging and global logistics.
Share your product requirements and specs — we'll respond with an initial proposal within one business day.
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