SHENZHEN SUNWIN ELECTRONICS TECHNOLOGY CO., LTD.
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Butterfly Laser BOX Device Packaging

Butterfly Laser BOX Device Packaging

Sunwin packages lasers and optoelectronic devices in butterfly and BOX housings: die attach and wire bonding inside metal or ceramic housings, optical subassembly placement and alignment, lid seam welding and helium leak testing.

BOXButterfly hermetic housings
HeliumLeak testing

sunwin@saketron.com · sunwin@thankgain.com · WhatsApp +86-18576601365

Automatic gold wire bonder
Automatic gold wire bonder

Assembly scope

  • Die attach and gold wire bonding inside metal or ceramic housings
  • Optical subassembly placement and alignment
  • Lid placement and parallel seam welding with first-article weld checks
  • Helium leak testing and MES record release
  • Housing configuration, feedthroughs and optical interface built to the customer drawing
Class 10,000 packaging cleanroom
Class 10,000 packaging cleanroom

Shared packaging platform

BOX packaging runs on the same cleanroom platform and MES-controlled flow as our MEMS TO packaging line: incoming control, die attach, wire bonding, sealing and leak testing.

Frequently asked questions

Do you build to customer housings?

Yes. Housing configuration, feedthroughs and optical interfaces follow the customer's drawing and specification.

What do you need for a quotation?

The package drawing, die list, optical alignment requirements, hermeticity specification and forecast volume.

Manufacturing base

Sunwin is the overseas business company of Shenzhen Saketron Electronics Technology Co., Ltd., its shareholder and manufacturing base since 2009. 21 SMT lines · 8,000+ m². Factory certifications

Related

Discuss your Butterfly Laser BOX Device Packaging project

To start an evaluation, send your Gerber or drawing files, BOM, package or assembly specification, test and quality requirements, and forecast volume.

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