From equipment configuration to quality systems, Sunwin is fully equipped to take on high-precision, modular product manufacturing.
Saketron Electronics, Sunwin's shareholder, runs our production: an 8,000+ m² four-floor facility in Shenzhen with SMT, COB, flip-chip and hermetic packaging lines.
ISO 9001, ISO 14001, IATF 16949 and HSPM certificates held by our manufacturing base, with the standard, scope, certification body and validity of each.
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SMT, COB, flip-chip and hermetic packaging workshops; production, test and inspection equipment; capacity and trade terms.
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IQC, IPQC and first-article inspection; X-ray, ICT, FCT and reliability testing; MES traceability and customer complaint handling.
View Management System →PCB and component sourcing, SMT, COB, device packaging and testing in one workflow.
Combined surface-mount and chip-on-board processes for high-precision, miniaturized products.
Full-process SPI / AOI / X-Ray / ICT / FCT inspection with MES traceability.
From small batches of 100+ units to mass production of millions, with flexible trade terms.
Contact us for factory qualification documents and capacity scheduling information.
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