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MEMS Optical Device TO Packaging

Sunwin provides hermetic Kovar TO packaging for MEMS optical switches, MEMS variable optical attenuators (VOA), lasers and photodetectors in TO-38, TO-46, TO-56 and TO-60 formats. Packaging runs in Class 10,000 cleanrooms with Class 100 control at critical steps, with capacity above 150,000 MEMS optical TO assemblies per month.

TO-38/46/56/60Kovar hermetic packages

150K+TO assemblies per month

±10 μmDie attach accuracy

Class 100Critical operations

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sunwin@saketron.com · sunwin@thankgain.com · WhatsApp +86-18576601365

Packaging scope

Devices	MEMS optical switches, MEMS VOA, lasers, photodetectors and sensor dies
Package formats	TO-38, TO-46, TO-56 and TO-60 Kovar hermetic packages; flat-window and custom lens caps
Processes	Die attach, silver epoxy dispensing, eutectic attach, gold wire bonding, lens micro-assembly, cap sealing, helium leak testing
Environment	Two Class 10,000 cleanrooms; Class 100 at critical operations
Capacity	More than 150,000 MEMS optical TO assemblies per month

MES-controlled packaging flow

Incoming control: MES labels for all materials, controlled silver epoxy storage time, headers stored in nitrogen cabinets, dies tracked by order
Die attach: plasma cleaning, die inspection, silver epoxy dispensing, placement, 3D microscope check for epoxy overflow and tilt, nitrogen cure
Wire bonding: gold wire bonding to the customer drawing, with loop height checked for cap clearance
Cap sealing or BOX seam welding, with first-article weld verification before batch production
Leak testing: pressure conditioning with nitrogen, helium leak detection, MES record completion and release

Key equipment

High-precision die bonder	±10 μm placement accuracy with automatic force monitoring
High-speed die bonder	3×5 to 60×60 mil dies, ±2.5 μm within a 50 mil field of view
Eutectic die bonder	Micron-level eutectic attach
Automatic gold wire bonder	Pattern recognition, servo motion and ultrasonic bonding
Cap sealers	Automatic sealer for volume builds; semi-automatic glove-box sealer with nitrogen for samples
Helium leak detector	Mass-spectrometer leak detection with automatic calibration and data output
Bond pull and shear tester	Wire pull, ball shear, die shear and micro-joint tests
Microscopes	Motorized 3D, metallurgical (up to 100×), stereo and digital measurement microscopes

Product examples

Example assemblies from our production lines.

MEMS Optical Device TO Packaging — MEMS Optical Device TO Packaging 01 — MEMS Optical Device TO Packaging 01

MEMS Optical Device TO Packaging — MEMS Optical Device TO Packaging 02 — MEMS Optical Device TO Packaging 02

MEMS Optical Device TO Packaging — MEMS Optical Device TO Packaging 03 — MEMS Optical Device TO Packaging 03

MEMS Optical Device TO Packaging — MEMS Optical Device TO Packaging 04 — MEMS Optical Device TO Packaging 04

Frequently asked questions

Which TO packages do you support?

TO-38, TO-46, TO-56 and TO-60 Kovar hermetic packages, with flat-window or custom lens caps.

How is hermeticity verified?

Sealed parts are pressure-conditioned with nitrogen and tested on a helium mass-spectrometer leak detector. Acceptance criteria follow the customer's specification, and every result is recorded in MES.

Can you build engineering samples?

Yes. A semi-automatic cap sealer with nitrogen glove-box handles samples and small lots, while automatic sealers run volume production of more than 150,000 assemblies per month.

What do you need for a quotation?

The device drawing, package specification, die and material list, reliability requirements and forecast volume.

Manufacturing base

Sunwin is the overseas business company of Shenzhen Saketron Electronics Technology Co., Ltd., its shareholder and manufacturing base since 2009. 21 SMT lines · 8,000+ m². Factory certifications